Patented Direct Silicon Footprint Microfluidics (DSFM) Technology. Heat is removed directly at the source, eliminating spreading resistance.
EMCOOL's microfluidic block allows for stable overclocking at remarkably high frequencies.
Unparalleled cooling performance allowing significantly lower temperatures than any other cooling product on the market.
While most commercial liquid cooling solutions are rated for no more than 250 W thermal design power (TDP), our patented cooling solution can easily remove up to 500 W TDP. Reach higher clock speeds at lower temperatures.
The advertised block is compatible with stock (on top of the original IHS) and delidded Intel Core CPUs from Gen 12 to Gen 14, and the latest Ultra 200 series CPUs. Direct-die contact requires the use of liquid metal for the best results.